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Intel NEX Product Development Engineer (ICE) in Malaysia

Job Description

  • Drives and develops testability and manufacturability of integrated circuits from the component feasibility stage through production ramp.

  • Contributes to design, development, and validation of testability circuits, test flows, and methodologies for new products through evaluation, development, and debug of complex test methods.

  • Interfaces with process development, fab, factory, assembly, quality and reliability, and manufacturing groups to enable postsilicon HVM ramp.

  • Evaluates new designs on automatic test equipment (ATE) and works with the design, DFx, and product development teams to debug functionality and performance issues to root cause.

  • Performs ATE device characterization, utilizes that data to define datasheet specifications and performs yield analysis.

  • Collaborates with designers to drive design for test/debug/manufacturing (DFT/DFD/DFM) features enabling efficient production testing of new products.

  • Develops and debugs complex software programs to convert design validation vectors and drive complex test equipment.

  • Creates and tests validation and production test hardware solutions.

  • Tests, validates, modifies, and redesigns circuits to guarantee component margin to specification.

  • Analyzes and evaluates component specification versus performance to ensure optimal match of component requirements with production equipment capability with specific emphasis on yield analysis and bin split capability.

  • Ensures manufacturability over process and product design through thorough analysis of process and spec corners and works with design to resolve yield issues before manufacturing ramp.

  • Drives test time reduction through analysis of fallout data versus test time for various IPs to balance and drive overall product cost optimizations.

  • Analyzes early customer returns with emphasis on driving test hole closure activities.

  • Creates and applies concepts for optimizing component production relative to both quality and cost constraints.

  • Leads and drives manufacturing readiness from fab, assembly, and test factory to support engineering sample and customer sample generation (ES milestones), wafer start planning, product qual execution strategy and capacity analysis, and assembly and test site certification activities.

  • Works with fab, assembly, and test factory partners and planners to support production ramp.

  • May also manage execution of new product introductions in the fab, fab process targeting, product/process optimizations, and participate in factory task forces to bring product perspective and respond to product issues.

  • Optimizes product supply through data analysis of postsilicon binsplit, die level cherry pick (DLCP), and optimize sort/test content and yield downstream through data analysis.

  • Seamless work/collaborate with various partners within and outside the organization specifically factory/HVM partner.

Qualifications

  • Engineering Graduates: Electrical and Electronics / Computer Engineering / Software Engineering / Microelectronics / Electronics and Communications / Mechatronics / Computer Science

  • CGPA: 3.0 and above or equivalent Bachelors or Master degree in Computer Science, Computer Engineering, Electronic Engineering or Information Technology

  • Minimum 2 years of experience in semiconductor manufacturing, testing, qualification and sustaining

  • Intermediate scripting knowledge using perl or python or other relevant scripting languages

  • Strong understanding of IC Test Methodology and Test Program required

  • AI knowledge/skill set will be an added advantage.

  • Possess creative mind, self-motivated and have passion in working with various Tester infrastructures and tools development and interacting with various partners including factory/HVM environment.

  • Ability to work in a fast-paced collaborative and often intense project schedule.

  • Possessed excellent communication and interpersonal skills.

  • Good team player as well as able to work independently.

  • This is a contract position.

Inside this Business Group

The Network & Edge Group brings together our network connectivity and edge into a business unit chartered to drive technology end to end product leadership. It's leadership Ethernet, Switch, IPU, Photonics, Network and Edge portfolio is comprised of leadership products critically important to our customers.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. (https://jobs.intel.com/en/benefits)

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

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