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Texas Instruments Field Applications Engineer - Connectivity in Shenzhen, China

Description

The Field Applications Engineer Connectivity (FAEC) is responsible for partnering with Sales and providing Connectivity related technical expertise throughout the sales cycle. The FAEC proactively identifies current products and/or creative solutions to solve existing customer projects and create new functionality/opportunities. Also in this role, the FAEC uses in-depth product knowledge to provide technical expertise to gain credibility and develop relationships with customers.

In this role, your responsibilities include:

  • Help TI secure customer commitments and win business by working on-site with customers in support of their engineering teams developing applications

  • Recommend and implement system solutions to customers in a consultative role

  • Develop custom applications and example code for key customers; debug software components in the customers end systems

  • Work closely with the sales team and product group to capture connectivity business and successfully take it to revenue

  • Take customer designs to revenue by providing prompt and thorough support for on-going design activity

  • Understand the competitive landscape; constantly applying lessons from customer engagement to refine this competitive understanding

  • Use competitive knowledge to tailor feedback to the product group for new product/feature development

  • Understand the specific business benefits that such feature/product enhancements will produce

  • Define and develop software and systems application notes and collateral for the above mentioned devices

  • Present at TI technical conferences and facilitate product specific customer trainings (seminars/workshops)

Qualifications

Minimum requirements:

  • Bachelor’s degree in EE/Comp Eng, or comparable

  • Minimum 3 years of relevant experience

Preferred qualifications:

  • Strong verbal and written communication skills

  • Strong presentation skills, with ability to effectively relate materials to customers

  • Demonstrated strong analytical and problem solving skills

  • Experienced on wireless connectivity technologies, e.g. WiFi, BT, Zigbee etc.

  • Familiar with MCU product and experience on technical support.

  • Experience on TI’s connectivity product will be a plus.

  • Ability to work in teams and collaborate effectively with people in different functions

  • Ability to take the initiative and drive for results

  • Strong time management skills that enable on-time project delivery

  • Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment

  • Demonstrated ability to build strong, influential relationships

  • Ability to efficiently context-switch between multiple concurrent tasks

  • Ability to advocate for customer needs (with an understanding of “why”) back into the TI product groups

Status Regular

Job: Sales

Primary Location: CN-CN-Shenzhen

Other Locations: CN-CN-Shanghai

Work Locations: Shenzhen > China, Shenzhen Shenzhen 518057

Req ID: 240006EV

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