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The Microsoft Silicon team is transforming the ways people communicate, create, and collaborate through the devices and components we develop. We’re a growing team and on a mission to develop revolutionary designs and provide leading edge silicon device solutions to power Microsoft computer and datacenter requirements. Microsoft systems including Azure, Xbox and HoloLens incorporate our internally developed silicon components. Our team is creative and resourceful; we value growth and learning. We want to amplify your abilities so you can do your best work. Join us, and together we’ll turn groundbreaking hardware designs into reality!

Microsoft Azure Hardware Engineering team is seeking a Senior Package Engineer to be responsible for providing support, expertise and insight to the Silicon device development team through the entire life cycle of the product. In this role, you will be responsible for supporting the design and implementation of new custom Silicon devices, evaluation and recommendation of new packaging technology, Substrate design support, device/package qualification, supplier assessment, manufacturing bring up, and driving quality/reliability in development and production.

Microsoft’s mission is to empower every person and every organization on the planet to achieve more. As employees we come together with a growth mindset, innovate to empower others, and collaborate to realize our shared goals. Each day we build on our values of respect, integrity, and accountability to create a culture of inclusion where everyone can thrive at work and beyond.

Responsibilities

• Drive package technology solutions for chiplet architecture with advanced packaging.

• Drive supplier assessments and manage suppliers through definition, development, qualification and production.

• Develop and deliver FMEA (Failure Mode and Effects Analysis) for various technology options.

• Define, design and develop test vehicles to validate Silicon, Package, System performance.

• Support substrate design working with suppliers and interna teams.

• Assess and characterize the reliability of Integrated Circuits (IC) packages.

• Design and develop package and assembly drawings to support the manufacturing.

• Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers.

• Drives the execution of architecture solutions across product lines or multiple product groups and across teams that account for design trends and future concepts by leveraging cross- functional expertise, industry best practices, and lessons learned from teams working across multiple product lines.

• Drives engineering system design decisions that require collaboration between internal and external stakeholders to account for platform-specific technology decisions and develop system models based on current and anticipated feature/design needs and trade-offs.

• Embody our Culture (https://www.microsoft.com/en-us/about/corporate-values) and Values (https://careers.microsoft.com/us/en/culture)

Qualifications

Required Qualifications

• Bachelor's Degree in manufacturing, material, mechanical, electrical, and industrial engineering, or related field AND 5+ years experience in a manufacturing environment/repair

• OR Master's Degree in manufacturing, material, mechanical, electrical, and industrial engineering, or related field AND 4+ years experience in a manufacturing environment /repair

• OR 7+ years equivalent experience.

• 4+ years of hands-on experience in the field of package manufacturing, supplier management, quality/reliability management and supply chain technical/quality management.

• 4+ years of experience in the Fabless semiconductor model with a broad knowledge of package technology, substrate manufacturing and advanced packaging (2D, 2.5D, 3D) and manufacturing.

Other Requirements

• Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to the following specialized security screenings: Microsoft Cloud Background Check:

• This position will be required to pass the Microsoft Cloud background check upon hire/transfer and every two years thereafter.

Preferred Qualifications

• Master's degree with 10 years’ experience in silicon packaging products development.

• Foundation in advanced packaging technologies, manufacturing and supplier management.

• Experience with OSAT, Supplier, Foundry technologies.

• Experience in physical failure analysis, subcontract supplier management.

• Record of success in cross-functional team environment.

Manufacturing Engineering IC4 - The typical base pay range for this role across the U.S. is USD $112,000 - $218,400 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $145,800 - $238,600 per year.

Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here: https://careers.microsoft.com/us/en/us-corporate-pay

Microsoft will accept applications for the role until May 9, 2024.

Microsoft is an equal opportunity employer. Consistent with applicable law, all qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations (https://careers.microsoft.com/v2/global/en/accessibility.html) .