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Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for passionate, high-energy engineers to help achieve that mission.

As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the Hardware, Infrastructure Management, and Fundamentals Engineering (HIFE) team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for seasoned engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure.

We are looking for a * * Principal Product & Test Engineer  to work in the dynamic Microsoft Silicon Manufacturing Packaging Engineering team (SMPE). The candidate must be a highly motivated self-starter who will thrive in this cutting-edge technical environment.

Responsibilities

• Oversee the development, manufacturing, fabrication, testing, and packaging of semiconductor integrated circuits (ICs).

• Drive pre-Si readiness for power, performance, Thermal and Power delivery related tests and features for successful bring up during power on. Drive Power and Performance tuning during post-Si phase in partnership with platform teams.  

• Drive Automated Test Equipment (ATE) test program implementation to optimize for System on Chip (SOC) power/Thermal Design Power (TDP). Work closely with platform/system engineers to drive necessary correlation work to enable such optimizations. 

• Drive product manufacturing fuse requirements and end to end data flow for fusing across various test sockets.  

• Manage external vendors, drive cross functional teams and drive sub-projects as part of larger development programs. 

• They should also have excellent knowledge of ATE test program development including test method development, test bring-up, characterization, debug, and yield analysis.  

• Overall product engineering role taking product from definition to launch.  

Qualifications

Required/Minimum Qualifications

• 9+ years of related technical engineering experience

• OR Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience or internship experience

• OR Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience or internship experience

• OR Doctorate degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience.

• 8+ years of experience in Product development and manufacturing in large scale and/or high performance (i.e., AI, machine leaning, neural nets, CPU’s) and/or high power SoCs/chips. 

• 8+ years of experience in Developing Integrated Circuits (pre-silicon, first silicon bring-up, new product introduction). 

• 8+ years of experience in product and test engineering, specializing in ATE test program development. 

Other Requirements

Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.

Preferred Qualifications  

• Lead by effectively managing external vendors, guiding cross-functional teams, and overseeing sub-projects within larger development programs.

• The position requires someone with experience in semiconductor IC development, IC manufacturing, fabrication, testing, and packaging.

• They should also have excellent knowledge of ATE test program development including test method development, test bring-up, characterization, debug, and yield analysis.

• Drive pre-Si readiness for power, performance, Thermal and Power delivery (LDOs, Integrated VRs) related tests and features for successful bring up during power on. Drive Power and Performance tuning during post-Si phase in partnership with platform teams.

• Drive product manufacturing fuse requirements and end to end data flow for fusing across various test sockets.

• The candidate should also have knowledge of DFT, silicon fabrication process, product Q&R, and basic transistor theory.

• The candidate would benefit from a background in various product market areas such as high-performance computing, AI, GPUs, CPUs.

• Overall product engineering role taking product from definition to launch.

• Experience in system/customer requirements gathering and interfacing. 

• Si configuration (SKU) management and internal supplier/customer interfacing 

• End-to-end product development flow and driving sample delivery milestones across the life cycle (Quality & Quantity)   

• Knowledgeable in yield recovery definition (redundancy and repair for logic, array, analog) and their implementation (test programs, test content, SKU). Drive implementation partnering with cross-functional teams. 

• Electrical Engineering and/or Device physics background. 

• System and Platform validation background is a plus. Experience working across various platforms (ATE/RVP/Customer boards) for product validation and characterization.  

Silicon Engineering IC5 - The typical base pay range for this role across the U.S. is USD $137,600 - $267,000 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $180,400 - $294,000 per year.

Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here: https://careers.microsoft.com/us/en/us-corporate-pay

Microsoft will accept applications for the role until November 14, 2024.

#azurehwjobs #HIFE #SCHIE # AHSI

Microsoft is an equal opportunity employer. Consistent with applicable law, all qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations (https://careers.microsoft.com/v2/global/en/accessibility.html) .