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Texas Instruments Packaging Engineer in Oita, Japan

Description

We can't predict what the future holds, but we know Texas Instruments will have a part in shaping it.

As a member of our packaging team, you’ll have the chance to interact with many product groups and functions. You’ll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.

Responsibilities may include:

Partnering with TI’s internal Power businesses to design and develop innovative power module packaging technologies, focused on miniaturization and integration:

  • Define and validate design rule roadmaps for multi-PCB power modules/sub-systems with vertical integration

  • Review and approve power module designs

  • Define and validate materials and process flows for these sub-systems

  • Define learning cycles and establish a robust assembly flow for new power modules

  • Guide the factory engineering team during qualification and production ramp of these sub-systems

  • Review assembly line quality and compliance

  • Lead discussions with customers on manufacturing and reliability aspects of power modules

Qualifications

Minimum requirements:

  • Bachelor's degree in Mechanical Engineering, Electrical Engineering or Materials Engineering

  • Minimum 10 years of relevant experience

Preferred qualifications:

  • Experience with:

  • packaging/assembly of power semiconductors

  • multi-PCB module assembly process

  • vertical integration of disparate components

  • reliability & manufacturability of electronic sub-systems/modules

  • directing materials & process flows in AT sites

  • mechanical & thermal modeling of power modules

  • Ability to establish strong relationships with key stakeholders critical to success, such as

  • sub-contractor and internal assembly sites

  • global design and manufacturing teams

  • component suppliers

  • Strong verbal and written communication skills

  • Working knowledge of engineering CAD tools

Why TI?

  • Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.

  • We’re different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI

  • Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.

About Texas Instruments

As a global semiconductor company, we design, manufacture, test and sell analog and embedded processing chips to nearly 100,000 customers. Our products enable electronics everywhere and in things you experience every day - from health care, smart homes and connected cars to drones, smart phones and more. Our passion to create a better and more sustainable world by making electronics more affordable through semiconductors drives us to make our technology smaller, more efficient, more reliable and more affordable.

Status Regular

Job: Engineering - Product Dev

Primary Location: MY-MY-Melaka

Other Locations: TW-TW-New Taipei City, PH-PH-Pampanga, PH-PH-Baguio City, MY-MY-Kuala Lumpur, JP-JP-Oita-Pref

Work Locations: Melaka > Malaysia, Melaka Melaka

Req ID: 240006ER

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