Easter Seals Jobs

Device Engineering

IYM (Integrated Yield Management)

• Process integration for mass production (FAB & Sort)

• Set KPI goal related to Yield performance (Yield, D0, YLD saving$,...)

• FA and problem solving in FAB & Unit probe

• Technology/process/product Transfers

Interface between BE / PL and FAB

• Primary contact window for site communication (FAB – Ass’y – BU – QA)

• New product and new process introduction to manufacturing (NPD & MRR)

• Support B/E open yield/quality issues & projects

• Process Change Management(PCP)

Process Engineering

• Make a powerful & competitive process. (Productivity/Quality/Cost/Technology)

• Problem solving techniques to resolve operational issues with unit processes

• Support a development of new technology & develop new unit process with creative thinking.

• Familiar with a broad range of semiconductor fabrications and clean room technologies.

• Improve process quality of Cp & Cpk.

• Make a cost reduction.

• Reduce wafer cycle time and wafer scrap