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Micron Technology, Inc. R&D Thin Films Process Development Engineer-3DNAND TD in Boise, Idaho

Our vision is to transform how the world uses information to enrich life for all .

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Thin Films Process Development Engineer at Micron Technology, Inc., you will contribute at a high level as part of the process technology team to develop deep sub-micron generation production-worthy, low-cost processes, including LPCVD/PECVD, ALD/PEALD, diffusion, ALO, RTP, and PVD. You will provide ownership for both process development & related tool issues for specific films/processes.

You will also be responsible for incorporating these processes into the corresponding process flow for application in high-density advanced memory parts, primarily 3D NAND applications.

Successful candidates for this position will have:

  • A minimum of 3 years of experience or equivalence of hands-on thin films research and development, preferably with experience in deposition for microelectronic devices.

  • The ability to work with a wide variety of people in different areas of R&D process, integration, pilot line, and high-volume production to effectively accomplish tasks in a timely manner.

  • The ability to plan and execute effective, well-designed experiments and write clear, concise reports documenting the results.

  • The ability to recognize, suggest process alternatives, and evaluate different options that may provide improved film properties and higher process margins.

  • The ability to give and take constructive criticism from other team members and can leverage input to drive projects forward.

  • An understanding of:

  • Chemical kinetics, thermal dynamics, plasma physics and chemistry, vacuum physics, and their direct application to thin film deposition processes including diffusion, LPCVD/PECVD, and ALD/PEALD deposition processes in various deposition reactors.

  • Electronic material properties resulting from various types of deposited thin films. Fundamental plasma processing and their impact on film properties. Statistical analysis, SPC/DOE. Thin films fundamentals and roles in all processing steps of forming memory devices, peripheral devices, and their IC circuit. Fundamental challenges in material exploration for device scaling.

  • Various thin-film electrical evaluation methods and techniques such as leakage, impedance, capacitance.

  • Various thin film physical and chemical evaluation methods and techniques such as SEM/EDS, TEM/EELS, XPS/AES, SIMS, RBS, ICP-GDMS, AFM, FTIR, Raman Spectroscopy, XRR, and XRD.

  • Micro- and/or nano-mechanical structures

  • Thin-film linear and non-linear mechanical behaviors and modeling

  • Experience and knowledge of Fab metrology tools such as optical/electrical methods.

  • The ability to evaluate and make insightful inferences from large amounts of various types of data, such as physical & electrical analysis.

  • The ability to interact and collaborate with integration engineers to develop robust film and related module as well as deploy the process to internal customers in R&D and the production fabs.

  • The ability to be a self-motivated team player and be adaptable to Micron's changing needs including working extended hours if required.

  • The ability to be highly motivated and goal oriented.

  • The ability to aggressively focus on solving problems both as part of a team and individually.

  • Excellent verbal and written communication skill.

  • The ability to manage projects effectively making best use of available resources.

  • Dependability and the willingness to take responsibility for the development of a process and tool.

  • The ability and willingness to learn new skills as needed.

Education:

Ph.D. in Materials Science and Engineering, Chemical Engineering, Physics, Chemistry, Electrical Engineering or similar field. Extensive process development experience may substitute for Ph.D.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

To learn about your right to work click here. (http://www.justice.gov/crt/worker-information)

To learn more about Micron, please visit micron.com/careers

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

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